Intelligent laser cutting head for improving cutting efficiency (2)
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Multiple signal level triggers are set during the cutting process. Once the cutting process (due to material deformation, difficult to perform programmed geometry features, etc.) occurs, the trigger signal level will be higher than the normal level. At this point, the cutting process is automatically slowed or paused until the signal returns to normal. When the signal drops to "Resume Cut Trigger Level", the feed rate quickly returns to normal speed. This process is repeated again as long as the PS 130 signal rises again. In the event of a catastrophic event (unrecoverable damage to the cutting process), the trigger signal reaches the "accident signal level", causing the cutting process to abort and alerting.
Self-adjusting process monitors are of great benefit to end users: materials can be processed faster without constant supervision; feed rates can be increased with confidence to break through conservative levels and the cutting process continues at a robust production level. Moreover, the fast perforation time of the Whitney system can be shortened by 0.1 to 2.0 s, which can accumulate into a huge production time benefit with multiple perforation cycles.
The problem is prevented, allowing the cutting process to be automatically restored or manually intervened to avoid scrapping material and wasting production time, and to avoid damage to nozzles, lenses or other system components. As implemented by the self-adjusting process monitor option, the sensor provides additional performance and reliability assurance for the slab and sheet cutting process in addition to the fast puncturing time.
Highly accurate, non-contact sensor systems are key elements of today's technology, and these sensors use optoelectronic measurement technology to enable reliable application of modern processing methods. Through innovation in optical, electronic and mechanical components, the company will develop outstanding optoelectronics and image processing solutions for laser material processing and process monitoring to provide a more productive production environment.