US research and development cooling ion wind motor

Researchers at Purdue University, funded by Intel, have developed a technology that uses a small "ion wind motor" to dramatically increase the cooling and cooling effect of computer chips. The experimental device has increased the "heat transfer coefficient" by approximately 250. %, while other cooling enhancement test methods usually only provide 40% to 50% improvement.
The researchers built their experimental cooling system on a simulated computer chip. The experimental device consists of two positive and negative electrodes separated by 10 mm. After the voltage is applied to the device, the cathode collides with the air molecules along the way during the discharge to the anode, generating positive ions, which are then attracted back by the cathode. This formed an "ion wind" which enhanced the airflow on the surface of the experimental chip. Using infrared imaging technology, the researchers found that the ion wind generated by the experimental device can reduce the temperature of the computer chip by 25 degrees Celsius.
Conventional cooling techniques are limited by the "no-slip" effect, that is, when air flows through the surface of the object, the air molecules closest to the surface of the object remain stationary, and the flow of molecules farther from the surface of the object is gradually accelerated. This phenomenon prevents the computer from dissipating heat because it limits the airflow on the surface of the chip that most needs to dissipate heat. The new method may solve this problem. Using the ion wind effect, the airflow created by combining a conventional fan can directly act on the surface of the chip.
The experimental setup is very small and can be directly integrated into a computer chip in the future. Fan cooling performance in these areas can be enhanced by placing it in a specific "hot spot" of the chip. As cooling performance increases, smaller fans will be available, which will help engineers design thinner notebooks with lower operating temperatures.
The researchers will next focus on reducing the size of the components in the device from millimeters to micrometers and continually reinforce the system. Experts expect the new chip cooling technology to be used in computers and other portable consumer electronics products for three years.

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