Application of ceramic bond diamond grinding tools
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With the development of science and technology, new materials are constantly growing, and mechanical processing is developing in the direction of high quality, high precision, high efficiency and automation. The application range of ceramic bond diamond abrasive tools is wider and wider, and the dosage is increasing. Mainly used in rough grinding, fine grinding and super fine grinding of diamond tools, cubic boron nitride tools, hard alloys and new engineering ceramic materials, cermet, cast iron, ceramics, gemstones, ferrite, concrete, refractory materials, fiber Reinforced grinding and processing of plastics.
Diamond tools are mainly concentrated in PCD composites, chemical vapor deposition (CVD) coated tools and single crystal diamond tools. Selecting reasonable process parameters, ceramic bond diamond grinding wheel for grinding single crystal diamond, the grinding efficiency is higher than that of metal bond grinding wheel, the wear ratio is very small, and the processing cost is low. Therefore, grinding ceramic single crystal diamond with ceramic bond grinding wheel can greatly improve Breaking the grinding efficiency. In the grinding of PCD tools, since the resin binder is soft, it is easily deformed during grinding, and the PCD cutter cannot be effectively ground. The metal bond has a strong self-sharpness due to the strong bonding ability to the abrasive grains, and the grinding is poor. Low efficiency, and the metal bond grinding wheel will cause the most serious damage to the edge of the PCD tool; the comprehensive grinding efficiency, the durability of the tool and the processing quality of the workpiece surface, the ceramic bond diamond grinding wheel is the most suitable choice for grinding PCD tools. .
Fine-grained ceramic bond diamond abrasives are used for precision sizing of chrome-hardened steel bearing rollers.
Ceramic bond diamond grinding tools are used for precision machining of automobile, tractor crankshafts and hydraulic pump gear necks.
The ceramic bond diamond wheel with better toughness is used for rough grinding and fine grinding of the TV tube fluorescent screen. High-performance silicon wafers for integrated circuits are processed by ceramic bond diamond grinding wheels, which have high processing precision, low processing roughness, and no metal ion contamination of the silicon wafer after grinding, and the qualified rate of processed products is high.
New engineering ceramic materials are made in science and industry due to their excellent properties such as high hardness, high wear resistance, high temperature resistance, corrosion resistance, high stiffness to weight ratio, low density and strong chemical inertness. The application is increasingly widespread. For example, MgO single crystals are widely used in high-temperature superconducting, film substrates, and laser parts. The use of these new materials is prone to brittleness and cracks during processing, often accompanied by a large number of processing problems. Diamond is the hardest material in nature, and the abrasive tools made of it solve the processing problems of high hardness materials such as glass and ceramics. For the newly developed engineering ceramics such as silicon nitride, when grinding with a resin or metal bond diamond grinding wheel, it is easy to cause insufficient binding force of the bonding agent to the abrasive grains, and the abrasion is increased; or the toughness of the bonding agent is too large, the abrasive tool In the middle, there are few air holes, the grinding force is reduced, and it is difficult to trim after the grinding tool is blunt, which makes the whole grinding process more difficult. The ceramic bond is ceramic or vitreous, the bond is rigid, can withstand high temperatures, is suitable for finishing when grinding, and does not cause knife knives. Moreover, the ceramic bond has strong adhesion to the abrasive grains, good angular retention performance, and high-precision grinding. In addition, the ceramic bond diamond grinding wheel can be adjusted in hardness and pores during the manufacturing process, which is beneficial to the improvement of the grinding performance. Without reasonable ratio and production control, no deformation will occur, which is also a high precision of the grinding wheel. the reason.
When summed up to grind with a ceramic bond diamond wheel, it has the following advantages:
(1) High grinding efficiency;
(2) It has high wear resistance: the wear resistance of the grinding wheel is high, and the abrasive grain consumption is small, especially when grinding a very hard and brittle workpiece;
(3) The grinding force is small and the grinding temperature is low;
(4) The workpiece is ground with high precision, good surface quality, and good shape retention of the workpiece.
Therefore, the ceramic bond diamond grinding wheel has more and more obvious advantages in the grinding process of some special materials such as ceramics, and has a good prospect in the development of diamond abrasive tools. High-performance abrasive tools, which are considered to be high-speed, high-efficiency, high-precision, low-grinding cost and low environmental pollution, are more and more widely used, and are the hotspots of research and development of grinding tools in the world.
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